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SC2003 is a two-part, thixotropic potting and encapsulating compound designed for the protection of electronic devices. It has exceptional high temperature properties, suitable for use in applications where the operating temperature will be up to 200°C.
Features :
• Thixotropic resin; ideal for applications requiring high viscosity systems
• High thermal conductivity; ideal for applications requiring efficient heat dissipation
• Simple 1:1 mix ratio; aids ease of processing
• Exceptionally wide temperature range; ideal for applications reaching very high temperatures
Approvals :
RoHS-2 Compliant (2011/65/EU): Yes
UL Approval: Meets UL94 V-0
http://www.electrolube.com/products/thermal-management/sc2003/encapsulation_resins/