DOWSIL™ CN-8760 Thermally Conductive Encapsulant

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DOWSIL™ CN-8760 THERMALLY CONDUCTIVE ENCAPSULANT

Küldjenek ajánlatot erre a termékre

DOWSIL™ CN-8760 Thermally Conductive Encapsulant  
Two-part, 1 to 1, room temperature and heat curable to give manufacturing flexibility, gray elastomer with moderate thermal conductivity.  


Applications
DOWSIL™ CN-8760 Thermally Conductive Encapsulant is suitable for:

• Power modules 
• Adaptors 
• Inverters 
• Transformers 
• Ballasts 
• Sensors 
• Electric control units product

Features & Benefits

• Low viscosity 
• Good thermal conductivity 
• 1 to 1 mixing ratio 
• Room temperature curing 
• UL 94 V0 certified 
• Easy to mix and use 
• Good flowability for fast processing and short cycle times 
• Aids heat dissipation

Pdf:

• TDS DOWSIL CN 8760 Thermally Conductive Encapsulant.pdf