DOWSIL™ EA-6052 Fast Low-Temp Cure Adhesive
Rapid low temperature cure flowable to allow channel filling contains UV indicator for automated inspection
.Fast curing version of
DOWSIL™ 3-1598 HP
Adhesive.
Features & Benefits
- Flowable
- 1:1 mix ratio
- Heat cure
- Good cure rate at moderate temperatures
- Low void formation after cure for sensitive substrates
- Good working time after mixing
- High tensile strength
- UV indicator for inspection
- No added solvents
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Energy and time savings when cured at lower temperature or times
Applications
- Sealing lids and housings
- Attaching baseplates
- Gasketing
- Connector sealing
Application
- Methods
- Automated or manual needle dispense
