DOWSIL TC-6010 Thermally Conductive Encapsulant

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Termék kiválasztásaDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxy ResinELECTROLUBE ER2220 - 2 part Epoxy Resin ELECTROLUBE HTC – Non-silicone Heat Transfer CompoundELECTROLUBE HTCP – Heat Transfer Compound Plus - Non SiliconeELECTROLUBE HTCPX – Non-Silicone Heat Transfer Compound PLUS XtraELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low ViscosityELECTROLUBE HTCX – Heat Transfer Compound Xtra - Non SiliconeELECTROLUBE HTS – Silicone Heat Transfer CompoundELECTROLUBE HTSP – Silicone Heat Transfer Compound PlusELECTROLUBE SC2003 - 2 part Silicone ResinELECTROLUBE TBS – Thermal Bonding SystemELECTROLUBE TCOR – Thermally Conductive Oxime RTVELECTROLUBE TCORP Thermally Conductive RTV Plus (Oxime-Cure)ELECTROLUBE UR5633 - 2 part Polyurethane ResinHóvezető megoldásokTechnite hővezető lapkák

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DOWSIL TC-6010 THERMALLY CONDUCTIVE ENCAPSULANT

Küldjenek ajánlatot erre a termékre

DOWSIL TC-6010 Thermally Conductive Encapsulant is a two-component silicone elastomer material. It is designed especially for use in the manufacture of electrical and PCB system assembly products and modules. DOWSIL TC 6010 cures with heat to form elastic, thermally conductive rubber.

Key benefits:

• Lower viscosity for impregnation and its flowability
• Less filler caking and easy re-homogenous
• Thermal Conductivity ≤1.2 W/m∙K
• UL 94 V-0 Flammability
• Low volatile content (D4-D10) <100ppm (0.01%)

Pdf:

• TDS DOWSIL TC 6010 Thermally Conductive Encapsulant eng.pdf