DOWSIL TC-5550 Thermal Conductive Compound

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Termék kiválasztásaDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxy ResinELECTROLUBE ER2220 - 2 part Epoxy Resin ELECTROLUBE HTC – Non-silicone Heat Transfer CompoundELECTROLUBE HTCP – Heat Transfer Compound Plus - Non SiliconeELECTROLUBE HTCPX – Non-Silicone Heat Transfer Compound PLUS XtraELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low ViscosityELECTROLUBE HTCX – Heat Transfer Compound Xtra - Non SiliconeELECTROLUBE HTS – Silicone Heat Transfer CompoundELECTROLUBE HTSP – Silicone Heat Transfer Compound PlusELECTROLUBE SC2003 - 2 part Silicone ResinELECTROLUBE TBS – Thermal Bonding SystemELECTROLUBE TCOR – Thermally Conductive Oxime RTVELECTROLUBE TCORP Thermally Conductive RTV Plus (Oxime-Cure)ELECTROLUBE UR5633 - 2 part Polyurethane ResinHóvezető megoldásokTechnite hővezető lapkák

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DOW

DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND

Küldjenek ajánlatot erre a termékre

DOWSIL TC-5550 Thermal Conductive Compound is a high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance. 

Features & Benefits

• Good pump-out resistance for bare die application
• High thixotropy index(> 14)and solvent free formulation 
• High thixotropy index(> 14)and solvent free formulation 
• High thermal conductivity: 5.0W/mk
• Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
• Low thermal resistance: 0.04 °C-cm2/W at 40 psi

Pdf:

• TDS DOWSIL TC 5550 Thermal Conductive Compound eng.pdf